Ex parte KRIVOKAPIC - Page 1




               The opinion in support of the decision being entered today was not     
               written for publication and is not binding precedent of the Board.     


                                                            Paper No. 21              


                     UNITED STATES PATENT AND TRADEMARK OFFICE                        
                                    _____________                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                    _____________                                     
                            Ex parte ZORAN KRIVOKAPIC                                 
                                    _____________                                     
                                Appeal No. 1998-2649                                  
                            Application No. 08/616,990                                
                                   ______________                                     
                                      ON BRIEF                                        
                                   _______________                                    

          Before KIMLIN, GARRIS, and PAWLIKOWSKI, Administrative Patent               
          Judges.                                                                     
          GARRIS, Administrative Patent Judge.                                        
                                DECISION ON APPEAL                                    
               This is a decision on an appeal from the final rejection               
          of claims 1-29, which are all of the claims in the                          
          application.                                                                
               The subject matter on appeal relates to a plasma                       
          sputtering apparatus and method which includes a first and                  
          second wafer support located at the lower and upper ends                    
          respectively of a chamber, a coil of conductive material                    





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