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Ex Parte Suga - Page 1

Legal Research Home > Board of Patent Appeals and Interferences > 2004 > Ex Parte Suga - Page 1

               The opinion in support of the decision being entered                   
               today was not written for publication and is not                       
               binding precedent of the Board.                                        
                                                            Paper No. 22              

                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                                                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                                                                     
                               Ex parte TADATOMO SUGA                                 
                                                                                     
                                Appeal No. 2004-0651                                  
                             Application No. 09/898,082                               
                                                                                     
                               HEARD: December 9, 2004                                
                                                                                     
          Before KRASS, DIXON and BLANKENSHIP, Administrative Patent                  
          Judges.                                                                     
          KRASS, Administrative Patent Judge.                                         

                                 DECISION ON APPEAL                                   
               This is a decision on appeal from the final rejection of               
          claims 1, 3-9 and 20-24.                                                    
               The invention is directed to a semiconductor device.  In               
          particular, it is said that the device is capable of achieving a            
          reliable electrical connection by securely directly bonding                 
          conductors to each other even though their bonding surfaces are             

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