Ex Parte Inaba - Page 1




        The opinion in support of the decision being entered today was not          
        written for publication and is not binding precedent of the Board.          
                                                              Paper No. 25          

                     UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                    __________                                      
                         BEFORE THE BOARD OF PATENT APPEALS                         
                                 AND INTERFERENCES                                  
                                    __________                                      
                               Ex parte TETSUYA INABA                               
                                    __________                                      
                                Appeal No. 2004-2040                                
                             Application No. 09/772,985                             
                                    ___________                                     
                                      ON BRIEF                                      
                                    ___________                                     
         Before PAK, DELMENDO, and JEFFREY T. SMITH, Administrative                 
         Patent Judges.                                                             
         DELMENDO, Administrative Patent Judge.                                     

                                 DECISION ON APPEAL                                 
              This is a decision on an appeal under 35 U.S.C. § 134                 
         (2003) from the examiner’s final rejection of claims 27 through            
         30 (final Office action mailed May 20, 2003, paper 18), which              
         are all of the claims pending in the above-identified                      
         application.                                                               
              The subject matter on appeal relates to a method of                   
         producing an electronic device (e.g., a multi-chip module).                
         (Specification, page 1, line 5 to page 8, line 8.)  Further                







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