Ex Parte Heinemann et al - Page 1

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                  The opinion in support of the decision being entered                
                       today was not written for publication and                      
                         is not binding precedent of the Board.                       


                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                    _____________                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                    _____________                                     
                              Ex parte ERIK HEINEMANN,                                
                                 FRANK PUSCHNER and                                   
                                   DETLEF HOUDEAU                                     
                                   _____________                                      
                                Appeal No. 2005-0088                                  
                             Application No. 10/160,629                               
                                   ______________                                     
                                      ON BRIEF                                        
                                   _______________                                    
          Before KIMLIN, WARREN and OWENS, Administrative Patent Judges.              
          KIMLIN, Administrative Patent Judge.                                        
                                 DECISION ON APPEAL                                   
               This is an appeal from the final rejection of claims 1-7.              
               Claim 1 is illustrative:                                               
               1.  A smart-card module, comprising:                                   
                    a substrate film formed of an anisotropically                     
               conductive material and having a surface;                              
                    at least one semiconductor chip having connection                 
               points and disposed on said substrate film; and                        







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