Appeal 2007-2501
Application 10/026,917
1 BACKGROUND
2 The invention is related to a method and system for manipulating
3 semiconductor substrates. A semiconductor substrate is placed on a
4 transportable electrostatic carrier (chuck) (Specification 13:7-8). The
5 substrate remains on the transportable electrostatic chuck during at least two
6 processing steps (Specification 13:11-14). Both the transportable
7 electrostatic chuck and the substrate are moved through the various
8 processing steps (Specification 14:2-4). The transportable electrostatic
9 chuck is charged beforehand and does not have any additional power supply
10 connected to it during the processing steps to allow the chuck to be moved to
11 the different locations (Specification 12:12-15 and 13:15-18).
12 B. Issue
13 The issue is whether Applicants have shown that the Examiner erred
14 in determining claims 1-4, 6-9, 11, 12, 14, and 15 to be unpatentable over
15 the prior art as applied by the Examiner.
16 C. Findings of fact (“FF”)
17 The record supports the following findings of fact as well as any other
18 findings of fact set forth in this opinion by at least a preponderance of the
19 evidence.
20 1. Applicants’ claims 1-4, 6-9, 11, 12, 14, and 15 are the subject
21 of this appeal.
which depends from claim 11 stands rejected.
3
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