Ex parte CHOI - Page 2




                Appeal No. 95-2579                                                                                                       
                Application 08/134,707                                                                                                   

                                                    The Claimed Subject Matter                                                           

                        The claims on appeal are directed to method of forming a pattern on a substrate using a solution                 

                of a partially imidized polyamic acid.  Claim 1 is representative of the claimed subject matter and reads as             

                follows:                                                                                                                 

                        1.  A method of forming a pattern on a substrate comprising                                                      

                        (A)  forming a first solution which comprises                                                                    

                                (1)  organic solvent, and                                                                                

                        (2)  monomers of                                                                                                 

                                (a)  diamine, and                                                                                        

                                (b)  dianhydride, tetracarboxylic acid or ester of tetracarboxylic acid;                                 

                        (B) polymerizing said monomers to form a polyamic acid soluble in said organic solvent;                          

                        (C) imidizing 10 to 95% of the amic acid groups in said polyamic acid to form a partially                        
                        imidized polyamic acid;                                                                                          

                        (D) forming a second solution of said partially imidized polyamic acid, which is more                            
                        concentrated than said first solution;                                                                           

                        (E) applying said second solution to a substrate;                                                                

                        (F) evaporating the solvent from said second solution to form a coating of said partially                        
                        imidized polyamic acid on said substrate;                                                                        

                        (G) using a process requiring exposure to light, removing a portion of said coating to form                      
                        a pattern on said substrate; and                                                                                 

                        (H) fully imidizing said partially imidized polyamic acid in said coating on said substrate.                     

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