Appeal No. 96-1507
Application 08/168,185
Appellant has appealed to the Board from the examiner’s
final rejection of claims 1 and 8, which constitute all the
claims remaining in the application.
Representative claim 1 is reproduced below:
1. A semiconductor device mounted in a resin sealed
container comprising:
a semiconductor element;
a base including a cavity in which said semiconductor
element is mounted, said base having a bonding surface;
a cover having a bonding surface and a side surface
transverse to the bonding surface of said cover, the bonding
surface of said cover being disposed on the bonding surface of
said base, thereby defining a closed volume including the
cavity;
at least two spaced apart masses of a temporary bonding
resin disposed between and contacting the bonding surfaces of
said cover and said base and including solid particles having
a grain size that determines spacing between the bonding
surfaces of said cover and said base; and
a thermosetting resin bonding material covering the side
surface of said cover and disposed on the bonding surfaces of
said base and said cover, sealing said cover to said base.
The following references are relied on by the examiner:
Schuessler 4,159,221 June 26,
1979
Kovacs et al. (Kovacs) 5,064,968 Nov. 12,
1991
2
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