Appeal No. 96-2085 Application No. 08/301,536 Udo teaches that if there is no particular reliability problem, the deposition of the first passivation layer may be omitted (column 6, lines 11-14), leaving the silicon nitride passivation layer as the sole protection layer which may be then be [sic] etched so that the fuse may be cut as previously done to the first passivation layer. [Page 9 of Answer]. However, the examiner has apparently misread Udo at column 6, lines 11-14. The relevant passage of Udo reads "[i]f there is no particular reliability problem even if cracks 26 or 33 in the bonding pad 20A or 30 are left exposed, only the fuses 4 need be covered with the passivation film 27." Contrary to the examiner's interpretation, there is no teaching here that first passivation film 22 may be omitted in favor of only second passivation film 27. Rather, the relevant passage relates that only fuses 4, and not bonding pad 20A or 30, need be covered with passivation film 27 if there is no reliability problem. As depicted in Figure 1H, passivation layers 22 and 27 are both present. The examiner goes on to state that "[i]n either case, Udo does teach that both the first and final passivation films are etched (column 5, lines 26-34 and lines 44-60)" (page 9 of Answer). However, the disclosures of Udo referenced by the examiner teach etching the first and final passivation films in the proximity of the opening 24, and not in the proximity of the fuse. Indeed, Udo discloses that "[t]he fuses, whether or not -5-Page: Previous 1 2 3 4 5 6 7 NextLast modified: November 3, 2007