Appeal No. 98-2398
Application No. 08/815,251
set forth in appellant’s claims on appeal. Like appellant, we
view the small mounds of material at the top of each of the
pins (102, 103) in Figure 1 of Duguet as being merely metal
connections formed by soldering, welding or brazing of the
pins to the conductive pads (121, 122) as set forth in column
3, lines 28-40 of Duguet, with the thin layer of
thermosensitive substance (104) being represented by the bold
line extending entirely across the top of the printed circuit
therein, although it is only the resistive strip (110) that is
heated up by the Joule effect to ignite the explosive varnish
layer (col. 3, lines 39-40). Thus, since Duguet has no
"ignition droplet," for this reason alone, we would refuse to
sustain the examiner’s rejection of claims 1 through 3, 11
through 13 and 16 on appeal.
However, we also find ourselves in agreement with
appellant’s position that the examiner’s use of the
information set forth on page 11 of appellant’s specification
and the use of the references to Muller et al. and VanName et
al. (answer,
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