Appeal No. 1998-1623
Application 08/433,625
DECISION ON APPEAL
This is a decision on appeal from the final rejection of
claims 20 through 37, all of the claims pending in the
application. Claims 1 through 19 have been canceled.
The invention relates to a method for joining a
semiconductor integrated circuit chip to a chip carrier
substrate and the resulting chip package.
Independent claim 20 is reproduced as follows:
20. A method for fabricating a semiconductor chip
package, comprising the steps of:
bringing a region of solder, mounted on a chip contact
pad of a semiconductor integrated circuit chip, into contact
with a carrier contact pad of a chip carrier substrate, which
solder region has a composition which includes at least a
first component and a second component and which carrier
contact pad includes a pad region having a composition which
includes at least a third component; and
forming a region of material at and/or adjacent to the
interface between said solder region and said carrier contact
pad, which material region has a composition which includes at
least said second component and said third component, while
using said solder region and said carrier contact pad as
sources of said second component and said third component,
said material region having a melting temperature which is
lower than that of said solder region and of said carrier
contact pad.
The reference relied on by the Examiner is as follows:
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