Appeal No. 1998-3033
Application No. 08/794,982
The disclosed invention relates to an electrical
interconnection structure between a first substrate and a
second substrate. The interconnection structure comprises at
least one eutectic composition formed in the surface of a
solder ball located on the first substrate. The eutectic
composition is joined to the second substrate via a metal
located thereon.
Claim 23 is the only independent claim on appeal, and it
reads as follows:
23. An electrical interconnection structure between a
first substrate and a second substrate, comprising, a ball
limiting metallurgy on said first substrate; a solder ball
secured to said ball limiting metallurgy, said solder ball
being deformed due to reflow processing; at least one eutectic
composition formed in the surface of said deformed solder
ball, said eutectic comprising a composition of pure metal and
a portion of said solder formed by interaction of a pure metal
overlayer and the outer surface of said deformed solder ball
contacted by said pure metal overlayer; and a metallurgy on
said second substrate securely adhered to said at least one
eutectic composition thereby forming said electrical
interconnection structure between said first substrate and
said second substrate.
The references relied on by the examiner are:
Noll 3,512,051 May
12, 1970
Best et al. (Best) 3,561,107 Feb. 9,
1971
Claim 24 stands rejected under the second paragraph of
2
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