Appeal No. 2000-0067
Application No. 08/561,570
conjunction with or in lieu of the step of supplying heat. To
remedy this deficiency of Kozlowski, the examiner relies upon
Dandridge as evidence that it was known in the art to adhere a
fabric to a porous substrate by interposing a solvent-
activated thermoplastic adhesive. However, Dandridge provides
no evidence that it was known in the art to utilize solvent
bonding in a molding process, in general, let alone any
molding process for fabricating a cushion assembly. Nor has
the examiner presented any evidence that it was known in the
art that heat bonding and solvent bonding are generally
equivalent and interchangeable.
The prior art admission relied upon by the examiner in the
rejection of claims 19 and 20, which entails a known polyamide
adhesive with phenolic nitrile, does not remedy the deficiency
of the combined teachings of Kozlowski and Dandridge discussed
above.
In conclusion, based on the present record, we are
constrained to reverse the examiner's rejections.
REVERSED
EDWARD C. KIMLIN )
Administrative Patent Judge )
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