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Ex parte DOCKERTY et al. - Page 1

Legal Research Home > Board of Patent Appeals and Interferences > 2001 > Ex parte DOCKERTY et al. - Page 1

               The opinion in support of the decision being entered                   
                    today was not written for publication and is                      
                         not binding precedent of the Board                           
                                                       Paper No. 19                   

                       UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                    _______________                                   
                           BEFORE THE BOARD OF PATENT APPEALS                         
                                   AND INTERFERENCES                                  
                                    _______________                                   
                              Ex parte ROBERT C. DOCKERTY,                            
                           RONALD M. FRAGA, CIRO N. RAMIREZ,                          
                          SUDIPTA K. RAY and GORDON J. ROBBINS                        
                                     ______________                                   
                                   Appeal No. 2000-0159                               
                              Application 08/688,073                                  
                                    _______________                                   
                              ON BRIEF                                                
                                    _______________                                   
          Before THOMAS, HAIRSTON and BARRETT, Administrative Patent                  
          Judges.                                                                     
          THOMAS, Administrative Patent Judge.                                        
                                                                                     
                                   DECISION ON APPEAL                                 

               Appellants have appealed to the Board from the examiner’s              
          final rejection of claims 1-10 and 21-24.                                   
               Representative claim 1 is reproduced below:                            
               1.  In a system for connecting a substrate having a low                
          coefficient of thermal expansion to a printed circuit board                 
          having a materially higher coefficient of thermal expansion using           
          an array of solder columns and reflow bonding, a supporting                 
          structure with effective heat sink coupling to the substrate,               
          comprising:                                                                 

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