Ex parte HUGHES - Page 3




          Appeal No. 1998-2308                                                        
          Application No. 08/379,868                                                  


                    14.  A method as in claim 13 wherein the potential is             
               applied from a high-impedance source.                                  
                    19.  A method of depositing oxidized coatings on a                
               pair of substrates in a chamber having throughout an                   
               atmosphere comprising a mixture of reactive and inert                  
               gases and having a sputtering station and an oxidizing                 
               station spaced apart within said chamber, the oxidizing                
               station providing a glow discharge, including the steps of             
               disposing one substrate at the sputtering station and                  
               there sputtering onto the substrate from a metal                       
               target a layer of elemental metal and oxidized metal,                  
               disposing the other substrate at the oxidizing station and             
               there subjecting it to reactive ions which oxidize the                 
               metal in any layer of elemental metal and oxidized metal               
               previously sputtered thereon, and repetitively moving the              
               one substrate between the sputtering and oxidizing                     
               stations while repetitively moving the other substrate                 
               between the oxidizing and sputtering stations.                         
                    20.  A method of depositing an oxidized metal coating             
               on a substrate in a chamber having throughout an                       
               atmosphere comprising a mixture of reactive and inert                  
               gases and having a sputtering station comprising an                    
               electrode and a target including the steps of disposing                
               the substrate at the sputtering station, applying between              
               the electrode and the target a generally square wave                   
               voltage such that the target has a negative voltage                    
               relative to the electrode for more than half a cycle and a             
               positive voltage relative to the electrode for less than               
               half a cycle, each of said positive and negative voltages              
               producing discharges well into the abnormal glow region                
               but a safe margin below the voltage at which an arc                    
               discharge would be initiated, the positive and negative                
               voltages having absolute values roughly equal to one                   
               another, the square wave voltage having a roughly constant             
               RMS value irrespective of its duty cycle, and varying the              
               duty cycle of said square wave voltage to oppositely vary              
               the DC and RMS AC components thereof such that the RMS AC              

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