Ex parte HILL - Page 1




          The opinion in support of the decision being entered today was not written for
                   publication and is not binding precedent of the Board.             

                                                            Paper No. 15              


                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                    _____________                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                    _____________                                     
                               Ex parte RODNEY L. HILL                                
                                    _____________                                     
                                Appeal No. 1998-2582                                  
                             Application No. 08/669,794                               
                                   ______________                                     
                                     ON BRIEF                                         
                                   _______________                                    

          Before CAROFF, KRATZ and DELMENDO, Administrative Patent                    
          Judges.                                                                     
          CAROFF, Administrative Patent Judge.                                        

                                 DECISION ON APPEAL                                   
               This decision on appeal relates to the examiner’s final                
          rejection of claims 12-17, all the claims now pending in                    
          appellant’s application.                                                    
               The claims are directed to a method of processing                      
          semiconductor wafers having an exposed aluminum-containing                  
          layer.  The method includes the step of rinsing the wafers                  







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