Appeal No. 1998-3401
Application No. 08/495,277
below:
1. A method of producing a circuit board,
comprising the steps of:
(a) patterning a resist layer that overlays a
substrate of the circuit board to define
desired circuit paths;
(b) removing the patterned resist layer in the
desired circuit paths;
(c) depositing a conductive material on the
circuit board in the pattern defined by the
removed resist layer so that the height of
the conductive material relative to the
substrate exceeds the height of the resist
layer relative to the substrate;
(d) applying a low-reactive solution, over at
least the conductive material, that initially
removes a surface portion of the conductive
material and forms a film barrier that
inhibits any further removal of the
conductive material;
(e) disrupting the film barrier to thereby
stimulate removal of additional surface
portion and formation of additional film
barrier; and
(f) repeating step (e) until the conductive
material is at a desired uniform height
relative to the height of the resist layer
above the substrate.
The examiner relies on the following prior art references as
evidence of unpatentability:
Ashcraft 4,693,959 Sep. 15, 1987
Kumar et al. (Kumar) 5,118,385 Jun. 2, 1992
Dull 5,468,409 Nov. 21, 1995
(filed Nov. 3, 1993)
Shigeta 60-006462 Jan. 14, 1985
(JP '462) (published
JP patent document)
September 23, 1997 (paper 10) that the amendment will be entered
upon the filing of a notice of appeal and an appeal brief.
2
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