Ex parte NAKAMURA et al. - Page 1




               The opinion in support of the decision being entered                   
               today was not written for publication and is not                       
               binding precedent of the Board.                                        
                                                            Paper No. 12              

                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                  ________________                                    
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                 AND INTERFERENCES                                    
                                  ________________                                    
                     Ex parte MAKIKO NAKAMURA, YASUHIRO FUKUDA,                       
                  YASUYUKI TATARA, YUSUKE HARADA and HIROSHI ONODA                    
                                  ________________                                    
                                Appeal No. 1999-0542                                  
                               Application 08/760,557                                 
                                  ________________                                    
                                      ON BRIEF                                        
                                  ________________                                    
          Before KRASS, JERRY SMITH and RUGGIERO, Administrative Patent               
          Judges.                                                                     
          JERRY SMITH, Administrative Patent Judge.                                   


                                 DECISION ON APPEAL                                   
          This is a decision on the appeal under 35 U.S.C. § 134                      
          from the examiner’s rejection of claims 42-57, which                        
          constitute all the claims remaining in the application.                     
          The disclosed invention pertains to a method for                            
          manufacturing a semiconductor device having a multi-layer                   

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