Appeal No. 1999-0884
Application No. 08/464,577
reduce heat transfer between them (page 12, line 22 to page
13, line 23).
Independent claims 6 and 24 are reproduced as follows:
6. A method for forming a film carrier tape for a
semiconductor device comprising the steps of
superposing a metallic layer on a carrier member and
etching the metallic layer so as to form metallic
leads and a heat sink separate from the metallic
leads for the semiconductor device.
24. A method of forming a laminated multi-chip
semiconductor device comprising a step of stacking a
plurality of chip semiconductor devices in multiple
layers on a substrate, wherein said chip
semiconductor devices are formed by the steps of:
providing a film carrier tape with leads;
electrically connecting a semiconductor chip to
the leads of the film carrier tape;
mounting a heat sink separate from the leads
electrically connected to the semiconductor chip to
a surface of the semiconductor chip; and
providing a connector for the mounting of the
heat sink and electrically connecting the connector
to the leads of the film carrier tape.
The Examiner relies on the following references:
Takahashi et al. (Takahashi) 4,315,845 Feb. 16,
1982
Kuraishi 4,809,053 Feb. 28, 1989
Kitano et al. (Kitano) 5,047,837 Sep. 10, 1991
(filed Aug. 03, 1989)
Sugano et al. (Sugano) 5,198,888 Mar. 30, 1993
(filed Dec. 20, 1990, a divisional of 07/288,955,
4
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