Appeal No. 2000-0811
Application 08/964,734
The Rejections on Appeal
Claims 1-6, 12, and 14-16 stand rejected under 35 U.S.C.
§ 102(e) as being anticipated by Trabucco ‘737.
Claims 7, 9 and 10 stand rejected under 35 U.S.C. § 103 as
being unpatentable over Trabucco ‘737 and Hayes.
Claim 13 stands rejected under 35 U.S.C. § 103 as being
unpatentable over Trabucco ‘737 and Trabucco ‘848.
The Invention
The invention relates generally to the field of electronic
device packaging and more particularly to a method for attaching
solder members to a substrate. Claim 1 is the only independent
claim of all the claims on appeal and is reproduced below:
1. A method for attaching solder members to a
substrate comprising the steps of:
providing a substrate having specified solder
member receiving locations thereon;
forming a decal comprising a sheet having thereon a
plurality of solder members removably secured to said
sheet and at locations on said sheet designed to
replicate said solder member receiving locations on
said substrate;
aligning the decal with said first substrate to
cause said solder members to align with said solder
receiving locations; and
transferring the plurality of solder members on the
decal to the first substrate.
2
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