Ex Parte HO et al - Page 1



               The opinion in support of the decision being entered today was not     
               written for publication and is not binding precedent of the Board.     
                                                               Paper No. 22           
                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                    ____________                                      
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                    ____________                                      
             Ex parte PAUL KWOK KEUNG HO, THOMAS SCHULUE, RAYMOND JOY,                
                  WAI LOK LEE, RAMASAMY CHOCKALINGAM, BA TUAN PHAM                    
                           and PREMACHANDRAN VAYALAKKARA                              
                                    ____________                                      
                                Appeal No. 2001-1662                                  
                             Application No. 09/048,208                               
                                    ____________                                      
                                      ON BRIEF                                        
                                    ____________                                      
          Before WILLIAM SMITH, WALTZ, and POTEATE, Administrative Patent             
          Judges.                                                                     
          POTEATE, Administrative Patent Judge.                                       


                                 DECISION ON APPEAL                                   

               This is an appeal under 35 U.S.C. § 134 from the final                 
          rejection of claims 1-20, which are all of the claims pending in            
          the application.                                                            
               Claim 1 is representative of the subject matter on appeal              
          and is reproduced below:                                                    
          1.   A method of forming metal lines without microloading in the            
          fabrication of an integrated circuit comprising:                            





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