Ex Parte SPITSBERG et al - Page 5



          Appeal No. 2002-0190                                                        
          Application No. 09/149,018                                                  
               McMordie is silent as to whether the article contains                  
          sulfur.  However, McMordie discloses depositing the platinum                
          layer by electroplating (col. 7, lines 12-15; col. 9, lines                 
          62-63; col. 10, line 67; col. 14, lines 19-20), and the examiner            
          finds, based upon the appellants’ specification, that a platinum            
          layer formed by electroplating necessarily contains sulfur                  
          (answer, page 7).2  Because the examiner’s finding is reasonable            
          and the appellants have not argued that it is incorrect, we                 
          accept it as fact.  See In re Kunzmann, 326 F.2d 424, 425 n.3,              
          140 USPQ 235, 236 n.3 (CCPA 1964).                                          
               The examiner argues that McMordie grit blasts the                      
          aluminum/silicon layer in order to remove undiffused coating                
          residues, and that because this process step is the same as that            
          of the appellants, it would remove sulfur-concentrated material             
          as required by the appellants’ claim 1 (answer, pages 3-4).  The            
          examiner, however, has not established that McMordie’s undiffused           
          aluminum/silicon slurry material, i.e., material which has not              
          diffused into the platinum-coated substrate, contains sulfur.               
          Hence, the examiner has not established the McMordie would have             
          fairly suggested, to one of ordinary skill in the art, removing a           
               2 The specification states (page 4, lines 3-7): “The deposition of the platinum-containing
          first layer and the aluminum-containing second layer leave these layers with a relatively high
          sulfur content.  In particular, the first layer is normally electrodeposited onto the surface of the
          substrate, which leaves a high sulfur content in the first layer.”          
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