Appeal No. 1999-2406
Application No. 08/825,256
solution uniformly over the surface of the substrate.
2. A method of coating a solution on a surface
of a circular substrate, comprising the steps of:
positioning a slit nozzle above the circular
substrate;
ejecting the solution from the slit nozzle toward
the surface of the circular substrate so as to
minimize effects of surface tension of the solution
when the solution is brought into contact with the
surface of the substrate;
rotating the circular substrate at a first speed
to coat the solution on substantially the entire
surface of the circular substrate while the solution
is being ejected from the slit nozzle without
interruption, and while maintaining a tip end of said
nozzle out of contact with said solution after the
solution is ejected from the nozzle; and
thereafter rotating the circular substrate at a
second speed greater than said first speed to spread
the solution uniformly over the surface of circular
substrate.
5. A method of coating a solution on a surface
of a substrate, comprising the steps of:
non-uniformly coating the solution on
substantially the entire surface of the substrate
using a slit nozzle by ejecting without interruption
the solution from the slit nozzle toward the surface
of the substrate so as to cancel out surface tension
of the solution when the solution is brought into
contact with the surface of the substrate, and while
maintaining a tip end of said nozzle out of contact
with the solution after the solution is ejected from
the nozzle; and
thereafter rotating said substrate to spread the
non-uniformly coated solution over the surface of the
substrate under centrifugal forces.
The examiner has not relied on any prior art reference as
evidence of unpatentability.
4
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 Next
Last modified: November 3, 2007