Ex Parte CUTTING et al - Page 1




               The opinion in support of the decision being entered                   
               today was not written for publication in a law journal                 
               and is not binding precedent of the Board.                             
                                                               Paper No. 15           


                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                                                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                                                                     
                Ex parte LAWRENCE R. CUTTING, JOHN GERARD GAUDIELLO,                  
                   LUIS JESUS MATIENZO and NIKHIL MOHAN MURDESWAR                     
                                                                                     
                                Appeal No. 2001-0445                                  
                             Application No. 09/017,338                               
                                                                                     
                                      ON BRIEF                                        
                                                                                     
          Before KIMLIN, MOORE and POTEATE, Administrative Patent Judges.             
          KIMLIN, Administrative Patent Judge.                                        


                                 DECISION ON APPEAL                                   
               This is an appeal from the final rejection of claims 12-17,            
          all the claims remaining in the present application.  Claim 12 is           
          illustrative:                                                               
          12. An electrical card structure, comprising:                               
               a circuitized substrate having at least one wire bond pad              
               located thereon;                                                       
               a layer of a first metal substantially free of hydrogen                
               molecules located on said wire bond pad; and                           

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