Appeal No. 2002-0130
Application No. 09/265,479
The subject matter on appeal is directed to a ferrite core
assembly wherein a ferrite core of an inductive component is
directly bonded to a metal layer via a commercially available
particular electrically conductive adhesive. See the
specification, pages 2-4 and 6-8. This electrically conductive
adhesive not only must be thermally stable within an operating
temperature range of the inductive component, but also must be
capable of reducing damping of the inductive component. See the
specification, page 1, together with claim 1. Further details
of the subject matter on appeal are defined by representative
claim 1 which is reproduced below:
1. A ferrite core assembly of an inductive component
with a defined electric potential and reduced damping
behavior, comprising:
a ferrite core of an inductive component;
a metal layer disposed on said ferrite core; and
an electrically conductive adhesive bonding said
metal layer to said ferrite core, said adhesive being
selected so as to adhere and be thermally stable within
an operating temperature range of the inductive
component.
Claims 1 through 7 stand rejected under 35 U.S.C. § 102(e)
as anticipated by the disclosure of U.S. Patent 5,653,841 (filed
2
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