Ex Parte NAKAZONO et al - Page 2




            Appeal No. 2002-0500                                                          Page 2              
            Application No. 09/258,320                                                                        


            A rotary shaft 109 extends through, and is as rotatably supported by, the sleeve.  (Id.           
            at 1-2.)  A fan 108 is mounted to the shaft 109.                                                  


                   The sleeve features dynamic-pressure-generating grooves 113.  Oil 114 is                   
            provided to the grooves to lubricate the sleeve and the shaft.   (Id. at 2.)  A stopper           
            washer 110 mounted to the rotating shaft prevents the fan from "coming off from the               
            bearing."  (Id. at 3.)  A thrust sheet 107 and a thrust plate 106 are fixedly press-fitted        
            into the frame to support the shaft axially.  The appellants explain that when changes in         
            temperature produce a gap between the thrust plate and the frame, oil spills therefrom.           
            (Id.)  Because the thrust plate is separate from the frame, they add, "the flatness of the        
            bottom face of frame 101 is difficult to improve, which reduces adherence between th[e]           
            cooling device" and a semiconductor 300 to be cooled.  (Id.)                                      


                   Figures 1-3 of the appellants' specification show their cooling fan.  In contrast to       
            the aforementioned fan, the appellants use the bottom face of their frame housing 41              
            as a thrust supporter 70.  (Appeal Br. at 2.)  Because their thrust supporter is unitary          
            with the bottom of the frame housing, the appellants assert, oil is prevented from                
            leaking.  (Id. at 3.)  They add that the unitary formation improves flatness of the bottom        
            face, thereby improving adherence between the cooling device and a semiconductor                  
            300 to be cooled.  (Spec. at 12.)  The fan blades 8 of the appellants' cooling device             








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