Appeal No. 2003-0196
Application No. 08/601,258
references (Brief, page 4). Appellants argue that there would be
no reasonable expectation of success since Wienand teaches
formation of a platinum film with a desired TCR of 3850 ppm/K while
one using the process of Uriu would only expect to achieve the TCR
taught by Uriu, i.e., about 3700 ppm/K. Accordingly, appellants
submit that Uriu actually “teaches away” from making the proposed
combination of references (id.).
Appellants’ arguments are not persuasive. As correctly argued
by the examiner on page 6 of the Answer, the temperature-measuring
resistive elements and the methods of preparation disclosed by
Wienand and Uriu are the same or so similar that one of ordinary
skill in the art would have expected that the platinum film of
Wienand would have reasonably been expected to be deposited by the
method of Uriu, i.e., by applying and sintering an organoplatinum
compound. Additionally, we note that Uriu specifically teaches the
equivalence of a plating method (which would include both
evaporation and sputtering) and baking the coated and printed
metalloorganic platinum paste to form the desired temperature
detecting resistor film (see col. 2, ll. 46-51, and col. 8, ll. 7-
10). As correctly noted by the examiner, “[a]n express suggestion
to substitute one equivalent process for another is not necessary
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