Appeal No. 2003-0200 2
Application No. 09/250,524
in this application.
THE INVENTION
The invention is directed to a carrier module containing in part, an array of chip
bonding pads and a wiring layer on a substrate. The wiring layer includes flat metal
terminals which are physically separated and different from bonding pads. Additional
limitations are described in the following illustrative claim.
THE CLAIMS
Claim 57 is illustrative of appellants’ invention and is reproduced below.
57. A module, for subsequent placement onto an interconnect structure, comprising:
a substrate having a chip bonding surface;
an array of chip bonding pads on the chip bonding surface;
a computer chip bonded to the bonding pads;
a wiring layer on the substrate including flat metal terminals said flat metal terminals
physically separated and different from said bonding pads;
first bumps of a different metal having a melting temperature substantially lower
than the melting temperature of said metal terminals, said first bumps in direct
contact with and attached to said metal terminals;
second bumps of a solder material having a melting temperature substantially lower
than said melting temperature of said different metal of said first bumps, said second
bumps covering said first bumps.
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