Appeal No. 2003-0241
Application No. 09/271,615
depositing a dielectric layer over said metal
layer and over said array of openings in said metal layer;
forming one or more vias in said dielectric layer;
and
forming a bonding pad that is electrically
connected to said metal layer.
The examiner relies upon the following references as
evidence of obviousness:
Chittipeddi et al. 5,986,343 Nov. 16, 1999
(Chittipeddi) (filed May 4, 1998)
Lin 6,025,631 Feb. 15, 2000
(filed Nov. 24, 1998)
Appellants' claimed invention is directed to a method for
forming a bonding pad structure over an active circuit of an
integrated circuit device. The method entails electrically
connecting the bonding pad to an underlying, cushioning metal
layer through vias in a dielectric layer that is disposed between
the bonding pad and the metal layer. According to appellants,
"[t]he use of the support structure 20 and 30 can allow active
circuits 10 to be placed directly under the bonding pads 50 where
the support structure 20 and 30 can protect the underlying active
circuits 10 from shear and compressive stresses occurring during
bonding processes (Figure 2)" (page 2 of Brief, penultimate
paragraph).
-2-
Page: Previous 1 2 3 4 5 6 Next
Last modified: November 3, 2007