The opinion in support of the decision being entered today was
not written for and is not binding precedent of the Board.
Paper No. 36
UNITED STATES PATENT AND TRADEMARK OFFICE
__________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
__________
Ex parte JING S. GOH
__________
Appeal No. 2003-0249
Application 08/863,848
___________
HEARD: June 11, 2003
___________
Before FLEMING, DIXON, and SAADAT, Administrative Patent Judges.
FLEMING, Administrative Patent Judge.
DECISION ON APPEAL
This is a decision on appeal from the final rejection of
claims 1 through 8, all the claims pending in the instant
application.
Invention
The invention relates to packaging semiconductor devices,
and more particularly to packaging board on chip devices. Figure
1 illustrates that solder balls 100 are connected to the
1
Page: 1 2 3 4 5 6 7 8 Next
Last modified: November 3, 2007