Ex Parte Ngo et al - Page 6




          Appeal No. 2003-1206                                                        
          Application No. 09/773,063                                 Page 6           


          person having ordinary skill in the  art” (emphasis added).                 
          35 U.S.C. § 103(a)(1999); Graham v. John Deere Co., 383 U.S. 1,             
          14, 148 USPQ 459, 465 (1966).                                               
               Here, as pointed out by the appellants in their briefs, the            
          examiner has not established any convincing reason, suggestion or           
          motivation for combining both of Hong and Liu with the APA in a             
          manner so as to arrive at the claimed subject matter.  Concerning           
          this matter, the examiner has not carried the burden of                     
          reasonably showing why one of ordinary skill in the art would               
          have employed the teachings of Liu concerning a passivation layer           
          to prevent corrosion of a conductor to modify APA with or without           
          Hong in the manner proposed.  As noted by appellants in the                 
          briefs, the examiner has not identified any need for additional             
          corrosion protection for the device of APA that already includes            
          a capping layer.  Nor has the examiner identified why the device            
          of Hong needs such protection since Hong covers the conductive              
          material with a barrier (34) and dielectric layer (36) as shown             
          in drawing figure 1F.  More specifically, the examiner has not              
          established how the teachings of Hong with respect to the                   
          formation of a diffusion barrier over a conductor and under a               
          dielectric material are compatible with Liu’s teachings of a                
          passivation layer formed directly on the conductive material.               







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