Appeal No. 2003-1263
Application No. 09/068,999
21. A substrate structure comprising:
a first part formed on a wafer of material;
at least one second part formed on said wafer in substantially
the same plane as said first part and having a same thickness as
said first part, said first and second parts having at least one
set of opposing edges separated by a spacing; and
at least one joint of insulating material arranged in the
spacing and mechanically joining at least a portion of said first
and second parts and extending substantially over the entire
thickness of said parts,
wherein said first and second parts are electrically insulated
from one another, and
said joint of insulating material provides the only mechanical
link between said first and second parts.
The reference relied on by the examiner is:
Nishizawa et al. (Nishizawa) 5,607,875 Mar. 4, 1997
Claims 2, 4, 5, 15 and 21 stand rejected under 35 U.S.C.
§ 102(e) as being anticipated by Nishizawa.
Reference is made to the final rejection (paper number 20),
the briefs (paper numbers 22 and 24) and the answer (paper number
23) for the respective positions of the appellants and the
examiner.
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