Appeal No. 2003-1280 2
Application No. 09/476,633
metal plug in a via by polishing the metal layer and rinsing the surface of the metal plug
with hydrogen peroxide. The rinse removes at least one particle from the surface of the
metal plug. Additional limitations are described in the following illustrative claims.
THE CLAIMS
Claims 1, 6 and 23 are illustrative of appellants’ invention and are reproduced below.
1. A method of removing a particle from a surface of a metal plug formed in a via
comprising:
introducing a first agent to a metal layer;
polishing the metal layer with the first agent;
after polishing the metal layer, introducing a second agent comprising hydrogen
peroxide to rinse the surface of the metal plug; and
removing at least one particle from the surface of the metal plug.
6. The method of claim 1, wherein introducing the second agent comprises
introducing a second agent of approximately 4% by volume or less of hydrogen
peroxide.
23. A method of removing a particle from a surface of a metal plug formed in a via
comprising:
introducing a first agent to a metal layer;
polishing the metal layer with the first agent; and
after polishing the metal layer, introducing a second agent consisting of hydrogen
peroxide to rinse the surface of the metal plug.
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