In any event, we note that the '558 application describes a reticle stage drive unit' that
includes X axis linear motors comprised of magnetic tracks 62A and 62B and magnetic coils
60A and 60B and Y axis linear motors comprised of magnetic tracks 70A and 70B and coils 68A
and 68B. The magnetic tracks 70A and 70B are mounted on window frame guide members 40C
and 40D respectively. The motor coils 68A and 68B are mounted on the reticle stage 10. The
magnetic tracks 62A and 62B are mounted on fixed guides 64A and 64B respectively. The coils
60A and 60B are mounted on guide members 40A and 40B respectively. The guide members
40A-40D and the fixed guide members 64A and 64B are fastened to support structure 80 and
114A-114D (first frame). The drive tracks cooperate with the drive coils to move the reticle
stage. At least the drive tracks satisfy the limitation of a stationary part of the drive unit which is
fastened to a first frame as follows.
There are two parts to a motor: a stator and a rotor. A stator is defined as the stationary
part of a machine, such as a motor, and the rotor is defined as the rotating part (Webster's R New
Riverside University Dictionary, Copyright 1988 (definitions attached)). A linear motor is
defined as an electric motor that has in effect been split and unrolled into two flat sheets, so that
the motion between the rotor and stator is linear rather than rotary. (McGraw-Hill Dictionary of
Scientific and Technical Terms - Fifth Edition, copyright 1994 (definition attached)). In the
' We recognize that the'558 application describes an embodiment of a reticle drive unit
for moving a reticle stage and not a wafer stage drive unit for moving a wafer stage. However,
we note that Lee's claim 2 recites an object table (stage) for processing an object, and a drive unit
for displacing the object table. The claim is not limited to a particular object, e.g. a wafer versus
a reticle. In any event, the '558 application states in at least two places that the embodiment
described may be used for a wafer stage for processing a wafer (Ex. 2045, at 3, lines 21-26 and 5,
lines 31-33).
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