Ex Parte HERMANSEN et al - Page 2




          Appeal No. 1998-3242                                                        
          Application No. 08/700,133                                                  

          agent which comprises a dihydrazide compound, wherein this                  
          combination is rheologically stable at room temperature, cures at           
          about 100-125BC, and has a durometer Shore A of less than 95 upon           
          cure to provide a flexible and reworkable epoxy bond.  This                 
          appealed subject matter is adequately illustrated by independent            
          claim 1 which reads as follows:                                             
               1. A flexible epoxy adhesive consisting of a combination of            
          the following components:                                                   
               (a) at least one epoxide resin having a hardness not                   
          exceeding a durometer Shore D reading of 45 when cured with a               
          stoichiometric amount of diethylene triamine, said epoxide resin            
          being selected from the group consisting of the diglycidyl ether            
          of 4,4-butanediol, the diglycidyl ether of neopentyl glycol, the            
          diglycidyl ether of cyclohexane dimethanol, the diglycidyl ether            
          of polyoxypropylene glycol, and the polyglycidyl ether of an                
          aliphatic polyol; and                                                       
               (b) about 42-100 parts by weight of at least one latent                
          epoxy resin curing agent per 100 parts by weight of resin, said             
          latent epoxy resin curing agent comprising a dihydrazide                    
          compound,                                                                   
               wherein said combination is rheologically stable at room               
          temperature, cures at about 100-125BC, and has a durometer Shore            
          A of less than 95 upon cure to provide a flexible and reworkable            
          epoxy bond.                                                                 
               The references set forth below are relied upon by the                  
          examiner as evidence of obviousness:                                        
          Kamio et al. (Kamio)     4,360,649           Nov. 23, 1982                  
          Bagga et al. (Bagga)     4,734,332           Mar. 29, 1988                  
          Vachon et al. (Vachon)   4,866,108           Sep. 12, 1989                  
          Lee et al. (Lee), “Handbook of Epoxy Resins,” McGraw Hill,                  
          pp. 2-16 through 2-18 (1982).                                               

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