Ex Parte KIKUCHI et al - Page 4



          Appeal No. 2003-2020                                                        
          Application No. 08/944,208                                                  

          ester-amide, and contains more elements."  The examiner concludes           
          that claim 15 is not enabled by the specification.                          
               The examiner's position appears to be that the term                    
          "contains" requires additional elements other than those recited            
          immediately following the word contains.  However, that                     
          interpretation is incorrect.  The terms "include," "comprise,"              
          and "contain" allow for additional elements, but do not require             
          such.  In other words, the portion of the specification                     
          referenced by the examiner discloses antistatic polymers of                 
          polyether ester-amide alone and of polyether ester-amide combined           
          with other elements.  Therefore, claim 15 is enabled by the                 
          specification, and we will reverse the enablement rejection.                
               Regarding the obviousness rejection of claims 3, 4, and 9              
          through 14, representative claim 13 recites a disk cartridge,               
          made of at least two types of thermoplastic resins with different           
          heat-deforming temperatures, an antistatic polymer, and an                  
          inorganic filler.  Kato discloses a data recording cartridge (see           
          the abstract) which is made of a polymeralloy of styrol resin and           
          polycarbonate resin (see column 12, lines 29-30).  Kato discloses           
          (column 12, lines 31-34) that the styrol resin may be ABS resin.            
          We note that appellants (specification page 8) use polycarbonate            
          as a first component with high heat-deforming temperature and ABS           
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