Appeal No. 2004-2296
Application No. 10/017,031
BACKGROUND
The invention relates to packaging together a processor and different types of
memory. A “cross-point” memory may include a recently developed type of high
capacity memory known as a polymer memory. (Spec. at 2-3.) Claim 1 is reproduced
below.
1. A packaged integrated circuit comprising:
a processor;
a volatile memory; and
a cross-point memory.
The examiner relies on the following references:
Mauritz et al. (Mauritz) 5,276,834 Jan. 4, 1994
Kim et al. (Kim) 6,225,688 B1 May 1, 2001
(filed Feb. 4, 1999)
Hsuan et al. (Hsuan) 6,236,109 B1 May 22, 2001
(filed Feb. 1, 1999)
Haba et al. (Haba) 6,376,904 B1 Apr. 23, 2002
(filed Oct. 10, 2000)
Claims 1 and 18 stand rejected under 35 U.S.C. § 102 as being anticipated by
Mauritz.
Claims 1-24 stand rejected under 35 U.S.C. § 103 as being unpatentable over
Haba, Mauritz, Hsuan, and Kim.
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