Ex Parte Teterud et al - Page 5



          Appeal No. 2005-0666                                                        
          Application 10/044,678                                                      

          685, 686 (Fed. Cir. 1986); In re Piasecki, 745 F.2d 1468, 1472,             
          223 USPQ 785, 788 (Fed. Cir. 1984); and In re Rinehart, 531 F.2d            
          1048, 1052, 189 USPQ 143, 147 (CCPA 1976).  Only those arguments            
          actually made by appellant have been considered in this decision.           
          Arguments which appellant could have made but chose not to make             
          in the brief have not been considered and are deemed to be waived           
          [see 37 CFR § 41.37(c)(1)(vii)(2004)].                                      
          With respect to representative claim 1, the examiner                        
          finds that Contreras teaches the claimed invention except that              
          Contreras fails to explicitly disclose the arrangement of the               
          connection points in the form of first and second rows.  The                
          examiner cites Dandia as teaching a generic bump pattern on a               
          semiconductor chip.  The examiner finds that it would have been             
          obvious to the artisan to provide the circuit board of Contreras            
          with connection points in the form of first and second rows as              
          taught by Dandia [answer, pages 4-5].                                       
          Appellant argues that Contreras does not disclose or                        
          suggest the presently claimed invention.  Appellant also argues             
          that Dandia does not disclose or suggest the presently claimed              
          invention because Dandia does not disclose a read channel system            
          or a head.  Appellant then simply asserts the advantages of the             
          claimed invention [brief, pages 4-5].                                       
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