Ex Parte Beauchaine et al - Page 5



          Appeal No. 2005-1139                                            5           
          Application No. 10/410,792                                                  

          Oetiker, 977 F.2d 1443, 1445, 24 USPQ2d 1443, 1444 (Fed. Cir.               
          1992).  If that burden is met, the burden then shifts to the                
          applicant to overcome the prima facie case with argument and/or             
          evidence.  Obviousness is then determined on the basis of the               
          evidence as a whole and the relative persuasiveness of the                  
          arguments.  See Id.; In re Hedges, 783 F.2d 1038, 1039, 228 USPQ            
          685, 686 (Fed. Cir. 1986); In re Piasecki, 745 F.2d 1468, 1472,             
          223 USPQ 785, 788 (Fed. Cir. 1984); and In re Rinehart, 531 F.2d            
          1048, 1052, 189 USPQ 143, 147 (CCPA 1976).  Only those arguments            
          actually made by appellants have been considered in this                    
          decision.  Arguments which appellants could have made but chose             
          not to make in the brief have not been considered and are deemed            
          to be waived [see 37 CFR § 41.37(c)(1)(vii)(2004)].                         
               With respect to representative claim 37, the examiner finds            
          that Brehm teaches the same structure as claimed except that                
          Brehm does not expressly teach or suggest that the polished front           
          and rear sides of the wafer have mirror polished surfaces as                
          claimed.  The examiner cites Kato as teaching a double side                 
          silicon wafer polishing method in which both surfaces are mirror            
          polished.  The examiner finds that it would have been obvious to            
          the artisan to use a mirror polish finish as taught by Kato in              
          the wafer processing device of Brehm [answer, pages 3-4].                   





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