Ex Parte EVANS - Page 1



           The opinion in support of the decision being entered today was not written for
                     publication and is not binding precedent of the Board.           
                       UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                     ____________                                     
                          BEFORE THE BOARD OF PATENT APPEALS                          
                                   AND INTERFERENCES                                  
                                     ____________                                     
                             Ex parte DAVID RUSSELL EVANS                             
                                     ____________                                     
                                 Appeal No. 2005-1220                                 
                              Application No. 09/270,606                              
                                     ____________                                     
                                       ON BRIEF                                       
                                     ____________                                     
          Before KIMLIN, WALTZ and KRATZ, Administrative Patent Judges.               
          KRATZ, Administrative Patent Judge.                                         

                                  DECISION ON APPEAL                                  
               This is a decision on appeal from the examiner's final                 
          rejection of claims 1-20, which are all of the claims pending in            
          this application.                                                           
                                     BACKGROUND                                       
               Appellant's invention relates to a chemical-mechanical                 
          polishing (CMP) process.  An understanding of the invention can             
          be derived from a reading of exemplary claims 1 and 13, which are           
          reproduced below.                                                           
                    1. An method of fabricating an integrated circuit                 
               using CMP comprising:                                                  
                    providing a substrate with an overlying silicon                   
               dioxide layer, and without any dummy structure;                        
                    forming a CMP slurry containing cerium oxide;                     





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