Ex Parte Sambasivam et al - Page 5


          Appeal No. 2005-2073                                                        
          Application No. 10/033,854                                                  

          examiner are an essential part of complying with the burden of              
          presenting a prima facie case of obviousness.  Note In re                   
          Oetiker, 977 F.2d 1443, 1445, 24 USPQ2d 1443, 1444 (Fed. Cir.               
          1992).  If that burden is met, the burden then shifts to the                
          applicant to overcome the prima facie case with argument and/or             
          evidence.  Obviousness is then determined on the basis of the               
          evidence as a whole and the relative persuasiveness of the                  
          arguments.  See Id.; In re Hedges, 783 F.2d 1038, 1039, 228 USPQ            
          685, 686 (Fed. Cir. 1986); In re Piasecki, 745 F.2d 1468, 1472,             
          223 USPQ 785, 788 (Fed. Cir. 1984); and In re Rinehart, 531 F.2d            
          1048, 1052, 189 USPQ 143, 147 (CCPA 1976).  Only those arguments            
          actually made by appellants have been considered in this                    
          decision.  Arguments which appellants could have made but chose             
          not to make in the brief have not been considered and are deemed            
          to be waived [see 37 CFR § 41.37(c)(1)(vii)(2004)].                         
               With respect to representative claim 1, the examiner finds             
          that the admitted prior art teaches the claimed method except for           
          the step of forming a through hole extending from the substrate             
          first surface to the substrate second surface and the step of               
          disposing the underfill material through the through hole.  The             
          examiner cites Akram as teaching a method of fabricating a                  
          microelectronic package in which underfill material is disposed             
          through a through hole and dispersed by capillary action.  The              
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