Appeal No. 2006-1230 Παγε 5
Application No. 10/137,586
are being relied upon. The record indicates that a copy of the
translation of the entire document was sent to appellant in the
communication dated July 29, 2005. From the mailing date of the
translation, it would appear that the translation would have
crossed in the mail with the reply brief. To preserve the
integrity of the due process to which appellant is entitled, we
designate our affirmance, infra, as a New Ground of Rejection in
order to allow appellant the opportunity to reopen prosecution,
should appellant desire to do so. The following remarks rely on
this translation.
Turning to Saito, we find that the semiconductor device is
embodied by resin-molding a semiconductor chip (page 2). It is
disclosed (page 3) that in the prior art, laser marking caused a
channel with a depression shape formed on the resin surface. In
the alternate embodiment of figures 3a and 3b, the reference
discloses (pages 5 and 6) that the photosensitive resin film 7,
which includes a colorable material, is coated on the surface of
the molded resin component 1, where a character or mark is
exposed and formed in a flat fashion by means of ultraviolet
irradiation via a mask.
From this disclosure, we find that the photosensitive resin
7 is coated on the molded resin component 1, and the character or
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Next
Last modified: November 3, 2007