Appeal No. 2006-1467 Page 4
Application No. 10/302,271
Rejection of Claims 1-3
Appellants do not argue the claims separately. Thus, we
select claim 1 as the representative claim on which we decide
this appeal as to this ground of rejection.
Like appellants, Sluzewski discloses melting a solder ball
used for holding an electrical component or slider to a head
gimbal assembly in order to replace a defective component with a
new one. See, e.g., column 9, lines 50-57 and column 10, lines
30-35 of Sluzewski.
There is no dispute as to the examiner’s determination that
Sluzewski discloses or suggests a rework process including the
removal of a magnetic head transducer (slider) from connection
with an electrical conductor (suspension including circuitry that
is part of a head gimbal assembly) via the melting of a solder
ball. The solder ball is used to bind those elements together in
a manner permitting replacement of components, such as the
magnetic head transducer (slider). See, e.g., column 9, lines
50-57 and column 10, lines 30-35 of Sluzewski. However,
Sluzewski does not disclose the use of an airgun for heating the
solder ball to a melting temperature for replacing a defective
component in Sluzewski’s rework process. Nor does Sluzewski
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