Ex Parte Takaoka et al - Page 4


               Appeal No. 2006-1756                                                                                                  
               Application 10/087,742                                                                                                

               what it regarded as constituting a material change in the basic and novel characteristics of the                      
               invention. The question for our decision is whether PPG did so.”).                                                    
                       Our review of the written description in the specification reveals no teaching that Bi                        
               and/or In materially affect the basic and novel characteristics of the claimed solder composition,                    
               and indeed, appellants clearly state that                                                                             
                    [a] low-melting metal such as Bi or In may be added as a solder component to the                                 
                    solder in order to lower a working temperature. In this case, the invented solder can                            
                    exhibit the same advantages as above. [Specification, page 8, ll. 18-21.]                                        
               Thus, appellants have not carried their burden to establish that the written description in the                       
               specification evinces that Bi and/or In are deleterious to the basic and novel characteristics of the                 
               claimed composition of matter encompassed by the appealed claims, and thus, excluded from the                         
               claims by reasons of the transitional term “consisting essentially of.”  See PPG Indus., 156 F.3d                     
               at 1354, 48 USPQ2d at 1353-54; Herz, 537 F.2d at 551-52, 190 USPQ at 463.                                             
                       Appellants further submit, with respect to claim 2, that Rikiya would not have taught                         
               using the solder disclosed therein “in connection with a transition metal conductor which is                          
               liable to spread in molten tin nor a solder” in which the transition metal is, among others, Cu                       
               (brief, page 6).  The examiner responds that Rikiya would have disclosed that the lead-free                           
               solder disclosed therein can be applied to electronic equipment, and that it was well known that                      
               the transition metal Cu is used alone and in alloys as conductors in such equipment (answer,                          
               page 5).  Appellants reply that there is no evidence supporting the examiner’s contention that the                    
               use of   Cu in conductors was known, and that “to the extent that it may be true,” such a                             
               contention is “hindsight” as there is no evidence that “the conductor is liable to spread in molten                   
               tin” (reply brief, page 3).                                                                                           
                       We find substantial evidence in the record in support of the examiner’s position.  That                       
               Cu alone and in an alloy is used as a conductor in electronic equipment is so well known as to                        
               defy dispute, and appellants have not established to the contrary.  See In re Ahlert, 424 F.2d                        
               1088, 1091-92, 165 USPQ 418, 420-21 (CCPA 1970) (notice may be taken “of facts beyond the                             
               record which, while not generally notorious, are capable of such instant and unquestionable                           
               demonstration as to defy dispute”).  Thus, one of ordinary skill in this art would have reasonably                    
               applied a lead-free solder within the teachings of Rikiya, including a lead-free solder disclosed                     


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