Ex Parte Farnworth et al - Page 1



              The opinion in support of the decision being entered                  
              today was not written for publication in a law journal                
              and is not binding precedent of the Board.                            

                     UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                  ________________                                  
                         BEFORE THE BOARD OF PATENT APPEALS                         
                                 AND INTERFERENCES                                  
                                  ________________                                  
                Ex parte WARREN M. FARNWORTH and JOSEPH T. LINDGREN                 
                                  ________________                                  
                                Appeal No. 2006-2181                                
                             Application No. 10/878,586                             
                                  ________________                                  
                                      ON BRIEF                                      
                                  ________________                                  
         Before KIMLIN, JEFFREY T. SMITH and GAUDETTE, Administrative               
         Patent Judges.                                                             
         KIMLIN, Administrative Patent Judge.                                       

                                 DECISION ON APPEAL                                 
              This is an appeal from the final rejection of claims 1-20.            
         Claims 1 and 9 are illustrative:                                           
         1. A bond pad array comprising:                                            
                  a substrate having an array of contact regions, wherein           
         the ratio of a dimension of a contact region to a separation               
         distance between adjacent contact regions is at least 10:1; and            
                  a respective tapered nickel contact formed over each              
         contact region.                                                            
         9. The bond pad array of claim 1, wherein the ratio of the                 
         dimension of the contact region to the separation distance                 
         between contact regions is at least 15:1.                                  
                                        -1-                                         



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