Appeal 2006-1454
Application 09/004,524
Patent 5,483,421
64. On September 20, 1993, the Examiner entered an Advisory Action
indicating that claims 1, 2, 4-8, and 10-14 remained rejected under 35 U.S.C. § 103
over AAPA, Ushifusa, and Ogihara.
65. On September 30, 1993, applicants filed a Notice of Appeal.
66. On December 2, 1993, applicants filed an Appeal Brief (“the Brief”).
67. In the Brief at page 5, applicants argued:
Specifically, it is applicants’ position that there is nothing in the cited
art that teaches the use of a glass-filled organic chip carrier having a
coefficient of thermal expansion of at least 17 × 10-6 ppm/°C on which
an integrated circuit chip is mounted by means of solder ball
technology and wherein the chip carrier is mounted to a circuit board
having a similar coefficient of thermal expansion also by means of
solder ball technology.
68. Applicants further argued at pages 10-11 of the Brief:
Glass filled epoxy circuit boards are known as admitted by applicants.
Rather, the question is: Is there anything in the art that would lead one
to select an organic material having this coefficient of thermal
expansion as a chip carrier, mount an I/C chip onto this type of carrier
with solder ball connections, encapsulate the solder balls connections
and then mount this carrier to a circuit board having a coefficient of
thermal expansion similar to that of the chip carrier? When viewed in
this light, there is no suggestion or motivation found in the references.
69. On June 14, 1995, a panel (“the panel”) of the Board of Patent
Appeals and Interferences (“the BPAI”) entered an decision reversing the decision
of the Examiner rejecting claims 1, 2, 4-8, and 10-14 under 35 U.S.C. § 103.
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