Ex Parte GEDNEY et al - Page 26



              Appeal 2006-1454                                                                                         
              Application 09/004,524                                                                                   
              Patent 5,483,421                                                                                         

                     Application '467 minus the limitations of the “glass filled epoxy”                                
                     carder material and the requirement that the carrier have a CTE of “at                            
                     least 17 X 10-6 ppm/°C.”                                                                          
                           (VII). Clearly, in Claims 21 and 34, the Appellants are                                     
                     attempting to recapture subject matter surrendered by amendment                                   
                     during the prosecution of Application '467. Specifically, the                                     
                     Appellants are trying to recapture “a chip carrier formed of an organic                           
                     dielectric material” and “a circuit board formed of an organic material                           
                     having a coefficient of thermal expansion similar to the chip carrier”                            
                     wherein the chip carder is not limited to the glass filled epoxy material                         
                     of the patented claims, and the coefficient of thermal expansion of the                           
                     chip carrier is not limited to the specified range of values, i.e., at least                      
                     17 X 10-6 ppm/°C, of the patented claims.                                                         
                     92. The Examiner then held (see Answer, page 10):                                                 
                           (VIII). The Appellants are thus broadening the patented claims                              
                     of Application '467 in two aspects germane to the prior art rejection                             
                     (i.e., the glass filled epoxy and CTE of at least 17 X 10-6 ppm/°C of                             
                     the chip carrier). These above-cited two aspects were not only                                    
                     vigorously argued by the Appellants as critical to the patentability of                           
                     the claims over the prior art of record, but the Board further supported                          
                     and reiterated the Appellants' patentability arguments. Therefore, the                            
                     Appellants' Claims 21-25 and 34 of the instant Reissue Application                                
                     09/004,524, as broadened vis-a-vis the patented claims of Application                             
                     '467, are clearly in violation of the recapture rule under 35 USC § 251                           
                     as set forth in the guidelines for determining recapture by the Clement                           
                     court (In re Clement, (CAFC) 45 USPQ2d 1161).                                                     
                           (IX). Regardless of whether or not the “encapsulation material”                             
                     limitation in reissue Claims 21-25 and 34 is or is not a patentable                               
                     feature of the claims, the attempt to recapture the surrendered subject                           
                     matter as discussed in paragraph (VII), above . . . requires the                                  
                     rejection of Claims 21-25 and 34 under 35 USC § 251.                                              



                                                        - 26 -                                                         

Page:  Previous  19  20  21  22  23  24  25  26  27  28  29  30  31  32  33  Next

Last modified: September 9, 2013