Appeal 2006-3166
Application 09/843,582
Appellants describe how the complexing agent “reacts” with the metal
particles using the following terms: “bond,” “to complex,” and “bonded”
(Specification 2: 19; 5: 9-10; 6: 3, 14).
Appellants indicate the pad includes “the chemistry needed for metal
removal” (Specification 5: 22-23).
The complexing agent may be bonded, grafted, or blended onto
conventional polymer scrubber brushes (Specification 4: 28-30).
Appellants have not defined the claim term “chemically bond” in their
Specification.
Andros discloses an ionic sponge material for removing particles and
other surface contaminants from semiconductor wafers (col. 1, ll. 8-19).
Andros’ sponge brush operates by using a cationic radical to attract
and retain particles in the sponge material thereby removing the particles
from the surface (col. 7, ll. 38-41).
The particles and surface contaminants removed by Andros’ brush
include metal ions such as nickel, copper, palladium, and platinum group
metals (col. 12, ll. 62-65).
Andros discloses using polyvinylalcohol (PVA) as the material to
construct the sponge (col. 11, ll. 1-5).
Andros uses the PVA material as a “host” to carry a charged “guest”
such as polyethylenimine (col. 10, ll. 43-49; col. 11, ll. 1-5).
The host sponge containing the polyethylenimine scavenges heavy
metals (col. 11, ll. 23-27).
After the polyethylenimine has become saturated with charged
particles, it may be either induced to leave the host (i.e., PVA) by changes in
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Last modified: September 9, 2013