Ex Parte 6357595 et al - Page 6



                Appeal 2006-3236                                                                                
                Inter Partes Reexamination Control No. 95/000,006                                               

                       Proposed new claim 16 in the reexamination is reproduced below.                          
                Claim 16 is almost identical to claim 1 in the '595 patent except that the                      
                word "wall" is eliminated, as indicated in brackets.  For clarity, claim 16 is                  
                not underlined as required for a proposed new reexamination claim.                              
                             16.  A tray for storing a semiconductor integrated circuit device                  
                       having a package and wiring terminals on a lower surface of the                          
                       package, said tray comprising:                                                           
                             a substantially planar main body; and                                              
                             a first storage portion provided on a first surface of said main                   
                       body for storing the semiconductor integrated circuit device, said first                 
                       storage portion having a bottom surface and a first wall surface                         
                       extending from said bottom surface and arranged around the                               
                       semiconductor integrated circuit device when the semiconductor                           
                       integrated device is stored in said first storage portion;                               
                             a second wall surface disposed around a circumference of the                       
                       semiconductor integrated circuit device so as to limit horizontal                        
                       movement of the semiconductor integrated circuit device, said first                      
                       wall surface being inclined at an angle so as to support an edge of the                  
                       package of the semiconductor integrated circuit device such that the                     
                       wiring terminals of the semiconductor integrated circuit device do not                   
                       contact said first wall surface when the semiconductor integrated                        
                       circuit device is stored in said first storage portion, and said second                  
                       wall surface extending from said first wall surface in a direction away                  
                       from said first [wall] surface of said main body, wherein said second                    
                       wall surface is inclined at an angle larger than the angle of said first                 
                       wall surface, with respect to the horizontal.                                            



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