Appeal 2007-0413
Application 10/722,769
a) providing a workpiece;
b) providing a chemical-mechanical planarizing colloidal
slurry, said slurry comprising non-agglomerated multi-component particles
of a mixed oxide, oxyfluoride, or oxynitride composition, each particle
exhibiting a modified surface chemistry performance and having an
isoelectric point (pHIEP) greater than the pH of dispersed particles in
solution; and
c) abrading a surface of said workpiece with said multi-
component particles.
The Examiner relies upon the following reference in the rejection of
the appealed claims:
Yano US 6,740,590 B1 May 25, 2004
Appellants’ claimed invention is directed to a chemical-mechanical
manufacturing process (CMP) for planarizing or polishing a semiconductor,
metal, dielectric, etc. The process entails using a CMP colloidal slurry
comprising non-agglomerated multi-component particles of a mixed oxide,
oxyfluoride, or oxynitride composition.
Appealed claims 1-3 stand rejected under 35 U.S.C. § 102(e) as
anticipated by, or in the alternative, under 35 U.S.C. § 103(a) over Yano.
Claims 4-6, 8-12, 14-24, and 26-31 stand rejected under 35 U.S.C. § 103(a)
as being unpatentable over Yano.
With the exception of the group of claims 16-20, Appellants do not
present an argument that is reasonably specific to any particular claim on
appeal. Accordingly, with the noted exception, all the appealed claims stand
or fall together with claim 1.
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