Appeal 2007-0706
Application 09/905,172
STATEMENT OF THE CASE
The subject matter on appeal is directed to anti-reflection coatings and
hard masks for use in defining etch patterns within an underlying substrate
structure. (Specification 1). Further details of the appealed subject matter
are recited in representative claim 8 reproduced below:
8. A method of forming a multilayer antireflective hard mask
structure, said method comprising:
providing a substrate structure;
depositing a CVD organic layer over said substrate structure by a
plasma enhanced chemical vapor deposition process using a feed stream that
comprises a hydrocarbon species, said CVD organic layer comprising
carbon and hydrogen;
depositing a dielectric layer over said CVD organic layer;
providing a patterned organic photoresist layer over said dielectric
layer;
etching said dielectric layer through apertures in said patterned
photoresist layer in a first plasma etching step until apertures are formed in
said dielectric layer; and
etching said CVD organic layer through said apertures in said
dielectric layer in a second plasma etching step until apertures are formed in
said CVD organic layer.
As evidence of unpatentability of the claimed subject matter, the
Examiner has relied upon the following prior art references:
Cheng US 5,873,984 Feb. 23, 1999
Chapman US 5,976,769 Nov. 2, 1999
Tsai US 6,083,815 Jul. 4, 2000
Huang US 6,171,940 B1 Jan. 9, 2001
Lou US 6,200,881 Mar. 13, 2001
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